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NV4V31MF
Chapter Title
R08DS0045EJ0200 Rev.2.00
Page 6 of 7
Jun 20, 2013
<R>
NOTES ON HANDLING
1. Recommended soldering conditions
? Peak Temperature
≤
350
°C
? Time
≤
3 seconds
? Soldering of leads should be made at the point 2.0 mm from the root of the lead
? This device cannot be mounted using reflow soldering.
2. Usage cautions
(1) Take the following steps to ensure that the device is not damaged by static electricity.
? Wear an antistatic wrist strap when soldering the device.
We recommend a strap with a 1 MΩ
resistor.
? Make sure that the work table and soldering iron are grounded.
? Make sure that the soldering iron does not leak.
(2) Do not subject the package to undue stress.
The package has a tensile strength of 1N or less.
Do not exceed this rating. Also, avoid bending the leads as much as possible.
If the leads must be bent, bend them only once, making sure to anchor the stem base of the lead.
(3) Do not allow the cap glass of the package to become scratched or dirty.
Also, do not subject the cap glass to external force.
(4) Be sure to attach a heat sink to sufficiently dissipate heat.
(5) Use the device as soon as possible after opening the bag.
A Business Partner
o
f Renesas Electronics Corporation.
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